This document provides power dissipation data for the SOP-8FD, including measurement results and thermal resistance data under different ambient conditions. Detailed information about the evaluation board and the relationship between power dissipation and ambient temperature is provided.
This manual presents power‑dissipation reference data for the SOP‑8FD package. It lists the measurement conditions used to obtain the data, including ambient environment, board mounting, material type, thickness, copper trace coverage, and that the package is lead‑free and mounted on FR‑4.
The document includes a table of power‑dissipation values versus ambient temperature, as well as dimensions of the package and board layout details such as copper trace occupancy and heat‑sink connection.
| Dimensions | 40 x 40 mm (1600 mm² one side) |
|---|---|
| Copper trace coverage | 50% of board area |
| Lead‑free | Yes |
| Power dissipation at 25 °C | 1500 mW |
The data were measured with the package mounted on a board, natural convection cooling, lead‑free solder, FR‑4 material of 1.6 mm thickness, copper traces covering 50 % of the board area, and a heat‑sink tied to the copper traces.
At an ambient temperature of 25 °C the package can dissipate 1500 mW, while at 85 °C the dissipation drops to 600 mW.