This document is a design support document for VCSP50L2 (BD88410GUL) product.
This design support document for the ROHM VCSP50L2 semiconductor package details its structure, materials, and mechanical dimensions. It includes footprint and external dimensions, marking information, and handling precautions.
The document also covers packaging specifications such as tape‑and‑reel dimensions, quantity per reel, storage temperature and humidity ranges, recommended reflow temperature profile, and soldering restrictions. Additional data on peel‑back strength and acceptable missing‑IC rates are provided.
| Package | VCSP50L2 |
|---|---|
| Dehydrated weight | 4.3 mg |
| Storage temperature range | 5 °C to 30 °C |
| Storage humidity range | 40 % RH to 70 % RH |
| Specified storage period | 1 year |
| Maximum reflow preheat temperature | 260 °C |
| Soldering temperature range | 220 °C to 230 °C |
| Cover tape peelback strength | 0.2 N to 0.7 N |
| Units per reel | 3,000 pcs |
Store the package at 5 °C to 30 °C with 40 % RH to 70 % RH humidity.
The maximum preheat temperature is 260 °C, and the soldering zone should be between 220 °C and 230 °C.
No, the wave soldering method is not supported.
Each reel contains 3,000 pieces.