This design support document introduces the features and characteristics of VCSP50L1 (BU52004GUL) and application circuits, circuit constants and other information.
This design support document describes the VCSP50L1 semiconductor package, including its structure, materials, and recommended handling. It contains detailed information on tape and reel packaging, storage conditions, marking, soldering profiles, footprint dimensions, and underfill considerations.
Key technical data such as dehydrated weight, storage temperature and humidity ranges, recommended soldering temperature profile, and peelback strength are provided to aid designers in reliable board integration.
| Dehydrated weight | 0.001 g |
|---|---|
| Quantity per reel | 3,000 pcs |
| Recommended storage temperature | 5~30°C |
| Recommended storage humidity | 40~70% RH |
| Maximum reflow temperature | 260°C |
| Soldering temperature range | 220°C~230°C |
| Cover tape peelback strength | 0.2~0.7 N |
Each reel contains 3,000 pieces of the VCSP50L1 package.
The cover tape peelback strength is specified as 0.2 N to 0.7 N.