This document provides design support information for ROHM's VCSP50L1 (BU9891GUL-W) product, including its features and characteristics.
This design support document from ROHM describes the VCSP50L1 semiconductor package, covering its structure, materials, and recommended handling. It includes detailed information on tape‑and‑reel packaging, storage conditions, marking, soldering profiles, footprint and external dimensions, and safety precautions.
Key sections include the package structure, tape and reel specifications, recommended storage temperature and humidity, soldering temperature profile, peelback strength of the cover tape, and handling cautions for the silicon substrate. The document is intended for engineers designing with the VCSP50L1 component.
| Package | VCSP50L1 |
|---|---|
| Storage temperature | 5 to 30 °C |
| Storage humidity | 40 to 70 % RH |
| Soldering temperature | 220 °C to 230 °C |
| Preheating temperature | 130 °C to 190 °C |
| Cover tape peelback strength | 0.2 to 0.7 N |
Store the device at 5 °C to 30 °C with 40 % to 70 % relative humidity.
Preheat to 130 °C–190 °C, then solder at 220 °C–230 °C for up to 60 seconds.
The cover tape peelback strength is specified as 0.2 N to 0.7 N.