ROHM VCSP50L2 Design Support Document

Introducing the VCSP50L2(BD88215GUL) VDC/DC converter.


ROHM VCSP50L2 Design Support Document - cover page
Brand
ROHM
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
5
File format
PDF
File size
896 KB
Published
04 June, 2012
Updated
30 September, 2023
MD5 checksum
C6F5BFB1023C93E868AF55F10AC93043

About this manual

This design support document describes the VCSP50L2 semiconductor package, including its structure, materials, and detailed mechanical dimensions. It also covers packaging options such as tape‑and‑reel, packing style, and shipping specifications.

Key information includes recommended storage conditions, soldering temperature profiles, and handling precautions, helping designers integrate the component safely and reliably into their products.

What's inside

  • Structure and materials
  • Tape and Reel information
  • Packing style
  • Storage conditions
  • Marking lot number
  • Soldering conditions
  • Footprint dimensions
  • External dimensions
  • Precautions
  • Others

Specifications

Dehydrated weight4.3 mg
Recommended storage temperature5 to 30 °C
Recommended storage humidity40 to 70 % RH
Specified storage period1 year
Soldering temperature range220 °C to 230 °C
Preheating temperature range130 °C to 190 °C
Maximum reflow temperature260 °C
Tape‑and‑reel quantity per reel3,000 pcs
Cover tape peelback strength0.2 to 0.7 N

Frequently asked questions

What are the recommended storage temperature and humidity for VCSP50L2?

The recommended storage temperature is 5 °C to 30 °C and the humidity is 40 % to 70 % RH.

What is the recommended soldering temperature range?

The soldering temperature should be kept between 220 °C and 230 °C.

How many components are packed per reel?

Each reel holds 3,000 pieces of the VCSP50L2 package.

What is the cover tape peelback strength?

The cover tape peelback strength is specified as 0.2 N to 0.7 N.

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