This document provides design support for ROHM's VCSP50L1 (BU7346GUL) product, including its features and characteristics.
This design support document describes the VCSP50L1 semiconductor package, its structure, materials, and handling precautions. It includes detailed information on package dimensions, marking, and recommended storage conditions.
Key sections cover tape‑and‑reel packaging, storage environment, soldering temperature profiles, footprint dimensions, and safety precautions for handling the silicon substrate. The document is intended for designers and manufacturers integrating the VCSP50L1 into electronic equipment.
| Package type | VCSP50L1 |
|---|---|
| Dehydrated weight | 0.002 g |
| Recommended storage temperature | 5 °C to 30 °C |
| Recommended storage humidity | 40 % to 70 % RH |
| Specified storage period | 1 year |
| Maximum reflow temperature | 260 °C |
| Preheating temperature range | 130 °C to 190 °C |
| Soldering temperature range | 220 °C to 230 °C |
| Cover tape peelback strength | 0.2 N to 0.7 N |
| Units per reel | 3,000 pcs/reel |
The package should be stored at 5 °C to 30 °C with 40 % to 70 % relative humidity.
Use a preheat temperature of 130 °C to 190 °C, a peak reflow temperature up to 260 °C, and a soldering zone temperature of 220 °C to 230 °C.
Each reel contains 3,000 pieces of the VCSP50L1 package.
The cover tape peelback strength is specified as 0.2 N to 0.7 N.