The document mainly introduces the characteristics, application scenarios and other information of VCSP50L2 (BD1206GUL) product.
This Design Support Document provides detailed information for the ROHM VCSP50L2 (BD1206GUL) surface‑mount package. It includes the package structure, material composition, tape‑and‑reel packaging specifications, storage conditions, marking details, recommended soldering profiles, footprint and external dimensions, and handling precautions.
Key sections cover the package structure and materials, tape and reel dimensions, recommended storage temperature (5‑30 °C) and humidity (40‑70 % RH), soldering temperature limits (preheat up to 260 °C, reflow 220‑230 °C), and footprint dimensions for PCB layout. The document also outlines marking lot numbers and safety precautions for handling the silicon substrate.
| Tape quantity per reel | 3,000 pcs/Reel |
|---|---|
| Dehydrated weight per component | 0.004 g |
| Recommended storage temperature | 5 °C to 30 °C |
| Recommended storage humidity | 40 % to 70 % RH |
| Specified storage period | 1 year |
| Maximum preheat temperature for reflow | 260 °C |
| Reflow soldering temperature range | 220 °C to 230 °C |
The recommended storage temperature is 5 °C to 30 °C.
The maximum preheat temperature is 260 °C.
Each reel holds 3,000 pieces.
The soldering temperature should be between 220 °C and 230 °C.