This document is a design support document for ROHM VCSP50L1 (BU52002GUL)
This document describes the VCSP50L1 semiconductor package, covering its structure, materials, and external dimensions. It includes detailed tape‑and‑reel packaging data, storage conditions, marking information, and recommended soldering profiles.
Additional sections address footprint optimization, underfill material considerations, peelback strength, and handling precautions. The information is intended for designers integrating the VCSP50L1 into electronic equipment.
| Package type | VCSP50L1 |
|---|---|
| Quantity per reel | 3,000 pcs |
| Storage temperature | 5~30°C |
| Storage humidity | 40~70% RH |
| Reflow peak temperature | 260°C MAX |
| Preheat temperature range | 130°C~190°C |
| Cover tape peelback strength | 0.2~0.7 N |
| Peelback speed | 165~180 mm/min |
| Wave soldering support | Not supported |
The package should be stored at 5~30°C with 40~70% relative humidity.
Each reel contains 3,000 pieces of the VCSP50L1 package.
Preheat at 130°C~190°C, peak temperature up to 260°C, and soldering zone at 220°C~230°C.
No, the wave soldering method is not supported for this package.