This document introduces ROHM's VCSP50L1(BU9833GUL-W) product, including product characteristics and application circuits
This design support document describes the VCSP50L1 semiconductor package, including its structure, materials, tape‑and‑reel packaging, storage conditions, marking, soldering recommendations, footprint and external dimensions, and handling precautions. It also contains legal notices and contact information for ROHM.
The document offers detailed technical data such as weight, recommended temperature and humidity ranges for storage, reflow profiles, and guidelines for underfill and handling to ensure reliable assembly of the package in electronic equipment.
| Dehydrated weight | 0.002 g |
|---|---|
| Recommended storage temperature | 5 °C – 30 °C |
| Recommended storage humidity | 40 % – 70 % RH |
| Maximum reflow temperature | 260 °C |
| Reflow pre‑heat temperature range | 130 °C – 190 °C |
| Soldering temperature range | 220 °C – 230 °C |
| Cover tape peel‑back strength | 0.2 N – 0.7 N |
| Tape‑and‑reel quantity per reel | 3,000 pcs |
The recommended storage temperature is 5 °C to 30 °C and the humidity is 40 % to 70 % RH.
The maximum reflow temperature is 260 °C.
Each reel contains 3,000 pieces of the VCSP50L1.
The cover tape peel‑back strength should be between 0.2 N and 0.7 N.