This document introduces the design support document for ROHM's VCSP50L1(BU9829GUL-W) product, including its features and characteristics.
This design support document describes the VCSP50L1 semiconductor package, including its structure, materials, dimensions, and handling guidelines. It contains detailed information on tape‑and‑reel packaging, storage conditions, marking, and recommended soldering profiles.
The document also offers precautions for handling, underfill considerations, and notes on the suitability of the package for various electronic applications. It is intended for engineers designing PCBs that incorporate the VCSP50L1 component.
| Die material | Silicon |
|---|---|
| Lead material | Cu Post Cu |
| Encapsulation material | Epoxy Resin |
| External terminal solder | Sn-3Ag-0.5Cu |
| Encapsulation resin type | Polyamide‑imide Resin |
| Dehydrated weight | 0.003 g |
| Recommended storage temperature | 5 ~ 30 °C |
| Recommended storage humidity | 40 ~ 70 % RH |
| Specified storage period | 1 year |
| Maximum reflow temperature | 260 °C |
| Soldering temperature range | 220 ~ 230 °C |
| Peelback strength (cover tape) | 0.2 ~ 0.7 N |
| Peelback speed | 165 ~ 180 mm/min |
| Units per reel | 3,000 pcs |
The recommended storage temperature is 5 ~ 30 °C.
The maximum reflow temperature is 260 °C.
Each reel holds 3,000 pieces.
Use a soldering temperature of 220 ~ 230 °C.