This document introduces design support information for VCSP50L1 (BU52015GUL)
This document provides technical information for the ROHM VCSP50L1 surface‑mount package. It includes details on the package structure, materials, tape‑and‑reel packaging, storage conditions, recommended soldering profiles, and mechanical dimensions.
Additional sections describe footprint recommendations, underfill considerations, external dimensions, and labeling requirements. The information is intended for designers and manufacturers integrating the VCSP50L1 into electronic equipment.
| Storage temperature range | 5~30°C |
|---|---|
| Storage humidity range | 40~70% RH |
| Storage period | 1 year |
| Peelback strength | 0.2~0.7N |
| Recommended soldering temperature | 220°C~230°C |
| Preheating temperature | 130°C~190°C |
| Tape and reel quantity | 3,000 pcs per reel |
| External dimensions (mm) | 0.30401 × 0.50 |
The package should be stored at temperatures between 5 °C and 30 °C.
Recommended storage humidity is 40 % to 70 % relative humidity.
The reflow soldering temperature should be set between 220 °C and 230 °C.
No, the wave soldering method is not supported for this package.