This design support document introduces the design information of VCSP50L1(BU9889GUL-W), including product description, pin definition, application circuit, operating conditions, package size, etc.
This design support document provides technical information for the ROHM VCSP50L1 semiconductor package. It includes details on package structure, tape‑and‑reel packaging, footprint and external dimensions, as well as handling and storage recommendations.
Key sections cover recommended storage conditions, reflow soldering profiles, peel‑back strength of the cover tape, and cautions for handling and under‑fill use. The document also lists packaging specifications such as reel quantity and tape dimensions, helping designers integrate the component safely into their products.
| Package type | VCSP50L1 |
|---|---|
| Tape quantity per reel | 3,000 pcs |
| Dehydrated weight | 0.002 g |
| Storage temperature range | 5 to 30 °C |
| Storage humidity range | 40 to 70 % RH |
| Specified storage period | 1 year |
| Reflow peak temperature (max) | 260 °C |
| Preheating temperature range | 130 to 190 °C |
| Soldering temperature range | 220 to 230 °C |
| Cover tape peel‑back strength | 0.2 to 0.7 N |
| Cover tape peel‑back speed | 165 to 180 mm/min |
| Wave soldering support | Not supported |
Store the package at 5 °C to 30 °C with 40 % to 70 % relative humidity, and keep it for up to 1 year.
A single reel can hold 3,000 pieces of the VCSP50L1 package.
Preheat at 130 °C to 190 °C, peak temperature up to 260 °C, and soldering zone temperature between 220 °C and 230 °C.
No, the wave soldering method is not supported for this package.