This document provides design support for the product VCSP50L1(BU9847GUL-W) from ROHM, including its features and characteristics.
This design support document for the ROHM VCSP50L1 semiconductor package describes its structure, materials, and encapsulation. It includes detailed tape‑and‑reel packaging specifications, footprint and external dimensions, and handling precautions.
The document also outlines recommended storage conditions, soldering temperature profiles, and other reliability considerations such as peelback strength and underfill usage. Legal notices and contact information are provided at the end.
| Package type | VCSP50L1 |
|---|---|
| Dehydrated weight | 0.002 g |
| Storage temperature range | 5 °C – 30 °C |
| Storage humidity range | 40 % – 70 % RH |
| Maximum reflow temperature | 260 °C |
| Soldering temperature range | 220 °C – 230 °C |
| Cover tape peelback strength | 0.2 N – 0.7 N |
| Pieces per reel | 3,000 pcs |
Store the device at 5 °C to 30 °C with 40 % to 70 % relative humidity.
The maximum preheating temperature for reflow is 260 °C.
Use a soldering temperature between 220 °C and 230 °C.
Each reel contains 3,000 pieces of the VCSP50L1 package.