This document provides design support for ROHM's VCSP50L2 (BD88220GUL) product. The features and characteristics of the product will be described in detail in the document.
This design support document provides technical information for the ROHM VCSP50L2 surface‑mount package. It includes details on package structure, tape‑and‑reel packaging, storage conditions, marking, soldering profiles, and handling precautions.
Key sections describe footprint and external dimensions, recommended storage temperature and humidity, reflow soldering temperature limits, peel‑back strength, and packaging quantities. The document is intended for designers and manufacturers integrating the VCSP50L2 into electronic assemblies.
| Package type | VCSP50L2 |
|---|---|
| Dehydrated weight | 4.3 mg |
| Quantity per reel | 3,000 pcs |
| Storage temperature | 5 to 30°C |
| Storage humidity | 40 to 70% RH |
| Storage period | 1 year |
| Maximum reflow temperature | 260°C |
| Preheating temperature range | 130°C to 190°C |
| Soldering temperature range | 220°C to 230°C |
| Peelback strength | 0.2 to 0.7 N |
The package should be stored at temperatures between 5 °C and 30 °C and at 40 % to 70 % relative humidity.
Each reel holds 3,000 pieces of the VCSP50L2 package.
The cover tape peelback strength ranges from 0.2 N to 0.7 N.