This document is about VCSP50L1 (BU52003GUL) design support document, introducing the features and characteristics of the product
This document provides technical information for the ROHM VCSP50L1 semiconductor package. It includes details on the package structure, materials, tape and reel packaging, storage conditions, recommended soldering profiles, footprint dimensions, and guidance on underfill material.
Additional sections describe labeling, packing style, shipping specifications, and legal notices. The information is intended for designers and manufacturers integrating the VCSP50L1 into electronic equipment.
| Dehydrated weight | 0.001 g |
|---|---|
| Recommended storage temperature | 5 °C ~ 30 °C |
| Recommended storage humidity | 40 % ~ 70 % RH |
| Specified storage period | 1 year |
| Maximum reflow temperature | 260 °C |
| Preheating temperature range | 130 °C ~ 190 °C |
| Soldering temperature range | 220 °C ~ 230 °C |
| Cover tape peelback strength | 0.2 N ~ 0.7 N |
The package should be stored at 5 °C to 30 °C with 40 % to 70 % relative humidity for up to one year.
The reflow profile allows a maximum temperature of 260 °C, with a preheating zone of 130 °C to 190 °C and a soldering zone of 220 °C to 230 °C.
Cover tape peelback strength is specified as 0.2 N to 0.7 N, with a peelback speed of 165 mm/min to 180 mm/min.
No, the wave soldering method is not supported for this package.