This document describes the features and characteristics of ROHM's VCSP50L1 (BU52001GUL) product.
The Design Support Document describes the VCSP50L1 package offered by ROHM. It covers the package structure and materials, tape‑and‑reel packaging, storage guidelines, marking information, recommended soldering profiles, footprint dimensions, and underfill considerations.
Key technical data include a dehydrated weight of 0.001 g, storage temperature of 5‑30 °C with 40‑70 % RH humidity, a peak reflow temperature of 260 °C, and a tape quantity of 3,000 pieces per reel. The document also specifies cover‑tape peelback strength (0.2‑0.7 N) and provides detailed mechanical dimensions for PCB layout.
| Dehydrated weight | 0.001 g |
|---|---|
| Storage temperature range | 5~30 °C |
| Storage humidity range | 40~70 % RH |
| Recommended reflow peak temperature | 260 °C max |
| Tape quantity per reel | 3,000 pcs/reel |
| Cover tape peelback strength | 0.2~0.7 N |
The package should be stored at temperatures between 5 °C and 30 °C.
Each reel contains 3,000 pieces of the VCSP50L1 package.
The cover‑tape peelback strength is specified as 0.2‑0.7 N.