This is a design support document for VCSP50L3 (BD6184GUL)
This design support document provides technical information for the ROHM VCSP50L3 (BD6085GUL) semiconductor package. It includes details on the package structure, materials, tape‑and‑reel packaging, storage conditions, marking, soldering profiles, footprint dimensions and underfill recommendations.
Key sections cover the package’s material composition, recommended storage temperature and humidity, reflow soldering temperature limits, tape‑and‑reel quantity (2,500 pcs per reel), and mechanical dimensions for PCB layout. The document also notes that wave soldering and manual solder‑iron heating are not supported.
| Package | VCSP50L3 |
|---|---|
| Die material | Silicon |
| Post material | Cu |
| Encapsulation material | Epoxy Resin |
| External terminal solder | Sn‑3Ag‑0.5Cu |
| Storage temperature | 5~30 °C |
| Storage humidity | 40~70 % RH |
| Maximum reflow temperature | 260 °C |
| Preheating temperature range | 130~190 °C |
| Soldering temperature range | 220~230 °C |
| Tape‑and‑reel quantity | 2,500 pcs/reel |
Store the package at 5 °C to 30 °C with 40 % to 70 % relative humidity.
The maximum reflow peak temperature is 260 °C.
Each reel contains 2,500 pieces of the VCSP50L3 package.
No, wave soldering is not supported for this package.