This is a design support document for VCSP50L3 (BD9352GUL), which details the product's features and application circuits.
This design support document describes the VCSP50L3 semiconductor package, including its structure, materials, and detailed mechanical dimensions. It also covers packaging formats such as tape‑and‑reel, packing style, and shipping specifications.
Key technical information includes recommended storage conditions (5‑30 °C, 40‑70 % RH, 1 year), soldering profiles (preheat up to 260 °C, reflow 220‑230 °C), and handling precautions for the silicon substrate. The document also lists the quantity per reel (2,500 pcs) and provides footprint and external dimension data for PCB layout.
| Package | VCSP50L3 |
|---|---|
| Quantity per reel | 2,500 pcs/Reel |
| Storage temperature | 5 °C to 30 °C |
| Storage humidity | 40 % to 70 % RH |
| Storage period | 1 year |
| Maximum preheat temperature | 260 °C |
| Reflow soldering temperature range | 220 °C to 230 °C |
| Cover tape peelback strength | 0.2 N to 0.7 N |
Store the package at 5 °C to 30 °C with 40 % to 70 % relative humidity for up to one year.
Each reel contains 2,500 pieces of the VCSP50L3 package.
No, the wave soldering method is not supported for this package.