This is a design support document for VCSP50L3 (BD6084GUL)
This design support document provides detailed information for the ROHM VCSP50L3 semiconductor package. It includes package structure, material composition, tape‑and‑reel packaging specifications, and handling precautions.
Key sections cover storage conditions (temperature 5‑30 °C, 40‑70 % RH, 1‑year shelf life), recommended soldering profiles (preheat 130‑190 °C, reflow up to 260 °C, soldering 220‑230 °C), footprint and external dimensions, and labeling/lot‑number conventions.
| Package | VCSP50L3 |
|---|---|
| Die Material | Silicon |
| Lead Material | Cu Post Cu |
| External Terminal Finish | Sn‑3Ag‑0.5Cu Solder |
| Tape Quantity per Reel | 2,500 pcs |
| Recommended Storage Temperature | 5 to 30 °C |
| Recommended Storage Humidity | 40 to 70 % RH |
| Maximum Storage Period | 1 year |
| Recommended Soldering Temperature | 220 °C to 230 °C |
| Recommended Preheat Temperature | 130 °C to 190 °C |
Each reel contains 2,500 pieces of the VCSP50L3 package.
The recommended reflow soldering temperature range is 220 °C to 230 °C.