This is a design support document for VCSP85H1 (BH76916GU). It introduces the features and characteristics of the product, including application circuits, package dimensions, and pin configurations.
This design support document describes the VCSP85H1 semiconductor package, covering its structure, materials, and recommended handling. It includes detailed information on tape‑and‑reel packaging, storage conditions, marking, and soldering recommendations.
Key sections provide footprint dimensions, underfill material guidance, external dimensions, and legal notices. The document is intended for engineers designing with the VCSP85H1 and for those needing precise mechanical and process data.
| Package type | VCSP85H1 |
|---|---|
| Dehydrated weight | 0.004 g |
| Recommended storage temperature | 5~30 °C |
| Recommended storage humidity | 40~70 % RH |
| Specified storage period | 1 year |
| Maximum preheat temperature | 260 °C |
| Soldering temperature range | 220~230 °C |
| Cover tape peelback strength | 0.2~0.7 N |
| Cover tape peelback speed | 165~180 mm/min |
| Footprint dimension b3 | 0.25 mm |
| Components per reel | 3,000 pcs |
Each reel contains 3,000 components.
The footprint dimensions are e = 0.50 mm and b3 = 0.25 mm.