This design support document is a design guide for BU9897GUL-W. It details the internal structure, functional features, application circuits, and typical application circuits of BU9897GUL-W.
This document provides technical information for the ROHM VCSP50L2 semiconductor package. It includes details on the package structure, materials, tape‑and‑reel packaging, storage conditions, marking, and recommended soldering profiles.
Additional sections describe footprint and external dimensions, underfill material considerations, and packaging styles. Legal notices and contact information are also included.
| Dehydrated weight | 0.004 g |
|---|---|
| Reel quantity | 3,000 pcs/reel |
| Cover tape peelback strength | 0.2–0.7 N |
| Cover tape peelback speed | 165–180°/300 mm/min |
| Recommended storage temperature | 5–30 °C |
| Recommended storage humidity | 40–70 % RH |
| Maximum reflow temperature | 260 °C |
| Preheating temperature range | 130–190 °C |
| Soldering temperature range | 220–230 °C |
The recommended storage temperature is 5 °C to 30 °C.
The recommended soldering temperature is 220 °C to 230 °C.
Each reel contains 3,000 pieces of the VCSP50L2 package.
The cover tape peelback strength is specified as 0.2 N to 0.7 N.