This document describes the features and characteristics of the VCSP50L4 (BD26502GUL) product produced by ROHM.
This design support document for the ROHM VCSP50L4 semiconductor package includes detailed information on the package structure, materials, and dimensions, as well as tape‑and‑reel packaging, storage conditions, and recommended soldering profiles. It also lists marking conventions, footprint and external dimensions, and handling precautions.
The document is intended for designers and manufacturers who need to integrate the VCSP50L4 component into electronic assemblies, offering guidance on storage, soldering, and underfill considerations to ensure reliable performance.
| Dehydrated weight | 0.02 g |
|---|---|
| Recommended storage temperature | 5 °C to 30 °C |
| Recommended storage humidity | 40 % to 70 % RH |
| Maximum storage period | 1 year |
| Preheating temperature range | 130 °C to 190 °C |
| Soldering temperature range | 220 °C to 230 °C |
| Cover tape peelback strength | 0.2 N to 0.7 N |
| Units per reel | 2,500 pcs |
Store the device at 5 °C to 30 °C with 40 % to 70 % relative humidity, and keep it for no more than one year before use.
Use a preheat temperature of 130 °C to 190 °C (max 260 °C) and a soldering temperature of 220 °C to 230 °C.
The cover‑tape peelback strength is specified as 0.2 N to 0.7 N.
Each reel contains 2,500 pieces of the VCSP50L4.