This document provides design support for ROHM's VCSP50L2 (BD88420GUL) product, describing its features and characteristics.
This design support document describes the VCSP50L2 semiconductor package, its structure, materials, and mechanical dimensions. It includes detailed tape‑and‑reel packaging data, labeling, and shipping information for manufacturers and assemblers.
The document also outlines recommended storage conditions, handling precautions, and reflow soldering profiles to ensure reliable assembly. Users are advised to follow the specified temperature, humidity, and moisture limits, as well as the peelback strength and under‑fill guidelines.
| Package type | VCSP50L2 |
|---|---|
| Tape and Reel quantity | 3,000 pcs/Reel |
| Dehydrated weight | 4.3 mg |
| Storage temperature range | 5 to 30 °C |
| Storage humidity range | 40 to 70 % RH |
| Maximum storage period | 1 year |
| Reflow preheat temperature | 130 °C to 190 °C |
| Reflow soldering temperature | 220 °C to 230 °C |
| Cover tape peelback strength | 0.2 to 0.7 N |
| Cover tape peelback speed | 165 to 180 mm/min |
Store the package at 5 °C to 30 °C with 40 % to 70 % relative humidity for up to one year.
Use a preheat temperature of 130 °C to 190 °C, then a soldering temperature of 220 °C to 230 °C, not exceeding 260 °C.
Each reel contains 3,000 pieces of the VCSP50L2 package.