This design support document provides detailed information on the characteristics and application circuits of VCSP50L2 (BD9121GUL) for reference by design engineers.
This document describes the VCSP50L2 semiconductor package, including its internal structure, materials, and external dimensions. It also details the recommended tape‑and‑reel packaging, storage conditions, marking information, and soldering profiles.
The design support information is intended for engineers designing PCBs and handling the component, covering footprint optimization, underfill considerations, and safety notes for reliable assembly.
| Die material | Silicon |
|---|---|
| External terminal solder | Sn‑3Ag‑0.5Cu |
| Storage temperature | 5~30 °C |
| Storage humidity | 40~70 % RH |
| Tape and reel quantity | 3,000 pcs per reel |
| Cover tape peelback strength | 0.2~0.7 N |
| Maximum preheat temperature (reflow) | 260 °C |
Store the package at 5 °C to 30 °C with 40 % to 70 % relative humidity.
Each reel contains 3,000 pieces of the VCSP50L2 package.
The pre‑heat temperature may reach up to 260 °C, followed by a soldering temperature of 255 °C (220 °C–230 °C zone) for up to 60 seconds.
The cover‑tape peelback strength is specified as 0.2 N to 0.7 N.