This document introduces ROHM's VCSP50L3(BD6082GUL) product, including its features and characteristics.
This design support document provides detailed information for the ROHM VCSP50L3 semiconductor package. It includes the package structure, material composition, tape‑and‑reel packaging specifications, storage conditions, marking conventions, and recommended soldering profiles.
Key sections describe footprint and external dimensions, handling precautions, peel‑back strength of the cover tape, and guidance on under‑fill materials. The document also lists recommended temperature and humidity ranges for storage and outlines the reflow soldering temperature profile.
| Dehydrated weight | 13 mg |
|---|---|
| Storage temperature | 5 °C to 30 °C |
| Storage humidity | 40 % RH to 70 % RH |
| Specified storage period | 1 year |
| Maximum reflow temperature | 260 °C |
| Preheat temperature range | 130 °C to 190 °C |
| Soldering temperature range | 220 °C to 230 °C |
| Cover tape peelback strength | 0.2 N to 0.7 N |
Store the package at 5 °C to 30 °C with 40 % to 70 % relative humidity for up to one year.
Use a maximum temperature of 260 °C, preheat at 130 °C to 190 °C for up to 120 seconds, and solder at 220 °C to 230 °C for up to 60 seconds.
No, the wave soldering method is not supported.
The cover tape peelback strength is specified as 0.2 N to 0.7 N.