This design support document is about VCSP50L3 (BD6085GUL) , introducing its characteristics and application circuits.
This design support document describes the VCSP50L3 semiconductor package. It covers the package structure, materials, tape‑and‑reel handling, storage conditions, marking, soldering recommendations, footprint dimensions, underfill considerations, and external dimensions.
Key sections include detailed footprint dimensions, recommended storage temperature (5–30 °C) and humidity (40–70 % RH), a 1‑year storage period, reflow soldering temperature profiles, and packaging specifications such as 2,500 parts per reel.
| Storage temperature | 5~30°C |
|---|---|
| Storage humidity | 40~70% RH |
| Reel quantity | 2,500 pcs/reel |
| Reflow preheat temperature | 130~190°C |
| Reflow soldering temperature | 220~230°C |
| Peelback strength | 0.2~0.7 N |
Store the package at 5–30 °C with 40–70 % relative humidity for up to 1 year.
No, the wave soldering method is not supported.
Each reel holds 2,500 pieces of the VCSP50L3 package.
Preheat to 130–190 °C, then solder at 220–230 °C, with a maximum temperature of 260 °C.