This document is a design support document for rohm's vcsp50l2(bu9832gul-w) product
This design support document describes the VCSP50L2 semiconductor package. It covers the structure and materials, tape‑and‑reel packaging, storage conditions, marking information, recommended soldering profiles, footprint and external dimensions, and guidance on underfill material.
Additional sections include handling notes, peel‑back strength of cover tape, and a legal notice about usage and export restrictions. The information is intended for engineers designing with the VCSP50L2 package in typical electronic equipment.
| Die Material | Silicon |
|---|---|
| Lead Material | Cu Post |
| Encapsulation | Epoxy Resin |
| Solder Type | Sn‑3Ag‑0.5Cu |
| Dehydrated Weight | 0.004 g |
| Tape Quantity | 3,000 pcs/reel |
| Storage Temperature | 5 ~ 30 °C |
| Storage Humidity | 40 ~ 70 % RH |
| Reflow Max Temperature | 260 °C |
| Preheating Temperature | 130 ~ 190 °C |
| Soldering Temperature | 220 ~ 230 °C |
| Cover Tape Peel‑back Strength | 0.2 ~ 0.7 N |
The package should be stored at 5 ~ 30 °C with 40 ~ 70 % relative humidity.
The reflow profile allows a maximum of 260 °C, with a preheating zone of 130 ~ 190 °C and a soldering zone of 220 ~ 230 °C.
Each reel contains 3,000 pieces of the VCSP50L2 package.
The leads are soldered with Sn‑3Ag‑0.5Cu alloy.