This document describes the features and characteristics of the VCSP60N1 (BD6069GUT) product produced by ROHM.
This document provides technical information for the ROHM VCSP60N1 (BD6069GUT) semiconductor package. It describes the package structure, materials, tape‑and‑reel specifications, packing and shipping styles, and recommended storage and soldering conditions.
Additional sections cover marking lot numbers, footprint dimensions, underfill material guidance, and external dimensions, helping designers integrate the component into printed‑circuit‑board layouts and ensure reliable assembly.
| Package type | VCSP60ON1 |
|---|---|
| Dehydrated weight | 0.003 g |
| Quantity per reel | 3,000 pcs |
| Recommended storage temperature | 5 °C ~ 30 °C |
| Recommended storage humidity | 40 % ~ 70 % RH |
| Maximum storage period | 1 year |
| Reflow peak temperature | 255 °C (3 s) |
The package should be stored at temperatures between 5 °C and 30 °C.
Each reel holds 3,000 pieces of the VCSP60N1 package.
The recommended peak soldering temperature is 255 °C for up to 3 seconds.
The dehydrated weight of the VCSP60N1 package is 0.003 g.