This design support document describes the features and functions of VCSP50L3 (BD6083GUL).
The document describes the VCSP50L3 package structure and materials, including silicon die, copper post, epoxy resin mold compound and Sn‑3Ag‑0.5Cu solder terminals. It also details tape‑and‑reel packaging, storage conditions, marking, soldering profiles and footprint dimensions.
Additional sections cover handling precautions, recommended peel‑back strength for cover tape, and notes on under‑fill material usage. The information is intended for designers integrating the component into electronic equipment.
| Package type | VCSP50L3 |
|---|---|
| Tape quantity per reel | 2,500 pcs |
| Storage temperature range | 5 to 30 °C |
| Storage humidity range | 40 to 70 % RH |
| Specified storage period | 1 year |
| Soldering temperature range | 220 °C to 230 °C |
| Preheat temperature range | 130 °C to 190 °C |
| Cover tape peel‑back strength | 0.2 to 0.7 N |
| Cover tape peel‑back speed | 165 to 180° |
The package should be stored at 5 °C to 30 °C with 40 % to 70 % relative humidity.
The specified storage period is 1 year.
Use a soldering temperature between 220 °C and 230 °C.
Each reel contains 2,500 pieces of the VCSP50L3.