This document describes the VCSP50L2 semiconductor package, including its structure, materials, and detailed mechanical dimensions. It also covers tape‑and‑reel packaging, labeling, and shipping style.
Additional sections give recommended storage conditions, marking lot numbers, and soldering profiles, as well as handling precautions and optional underfill considerations.
| Package type | VCSP50L2 |
|---|---|
| Die material | Silicon |
| Lead material | Cu Post Cu |
| Mold compound (epoxy) | Epoxy Resin |
| External terminal solder | Sn‑3Ag‑0.5Cu |
| Dehydrated weight | 4.3 mg |
| Storage temperature | 5 °C to 30 °C |
| Storage humidity | 40 % to 70 % RH |
| Specified storage period | 1 year |
| Reflow preheat temperature | 130 °C to 190 °C |
| Reflow soldering temperature | 220 °C to 230 °C |
| Tape and reel quantity | 3,000 pcs per reel |
| Cover tape peelback strength | 0.2 N to 0.7 N |
Each reel holds 3,000 pieces of the VCSP50L2 package.
The cover‑tape peelback strength ranges from 0.2 N to 0.7 N.