This document is a design support document from ROHM Co., Ltd. about the VCSP85H4 (BD6086GU) product, describing its features and characteristics.
This design support document describes the VCSP85H4 semiconductor package, including its internal structure, materials, and external dimensions. It also details tape‑and‑reel packaging, labeling, and shipping information.
Additional sections cover recommended storage conditions, soldering profiles, peelback strength, and guidance on underfill material usage, helping designers integrate the component safely into their products.
| Dehydrated weight | 0.03 g |
|---|---|
| Recommended storage temperature | 5 ~ 30 °C |
| Recommended storage humidity | 40 ~ 70 % RH |
| Specified storage period | 1 year |
| Maximum reflow temperature | 260 °C |
| Preheating temperature range | 130 ~ 190 °C |
| Soldering temperature range | 220 ~ 230 °C |
| Cover tape peelback strength | 0.2 ~ 0.7 N |
Store the device at 5 ~ 30 °C with 40 ~ 70 % relative humidity for up to one year.
Use a maximum reflow temperature of 260 °C, preheat at 130 ~ 190 °C, and a soldering zone of 220 ~ 230 °C.
No, the wave soldering method is not supported for this package.
The cover tape peelback strength is specified as 0.2 ~ 0.7 N.