This design support document introduces the features of VCSP50L1 (BH6453GUL), application circuits and design considerations.
This ROHM design support document provides detailed information about the VCSP50L1 semiconductor package, including its structure, material composition, and recommended handling procedures. It covers packaging specifications such as tape and reel dimensions, storage conditions, marking, and soldering guidelines.
The document also lists footprint and external dimensions, as well as precautions for handling and under‑fill material usage. It is intended for engineers designing circuits that incorporate the VCSP50L1 component.
| Package | VCSP50L1 |
|---|---|
| Die Material | Silicon |
| Post Material | Cu |
| Mold Compound | Epoxy Resin |
| External Terminal Solder | Sn‑3Ag‑0.5Cu |
| Tape Dimensions (mm) | 1.74 × 1.05 × 61.5 × 60.5 × 1.75 × 4.0 × 4.0 × 2.0 × 0.25 × 8.0 × 180 × 60 |
| Reel Dimensions (mm) | 20.1 × 40.1 × 0.1 × 0.1 × 0.1 × 0.1 × 0.05 × 40.3 |
| Recommended Storage Temperature | 5 °C to 30 °C |
| Recommended Storage Humidity | 40 % to 70 % RH |
| Specified Storage Period | 1 year |
| Recommended Soldering Temperature | 220 °C to 230 °C |
| Cover Tape Peelback Strength | 0.2 N to 0.7 N |
The document specifies a storage temperature range of 5 °C to 30 °C.
A soldering temperature of 220 °C to 230 °C is recommended.
The tape dimensions are listed as 1.74 mm × 1.05 mm × 61.5 mm × 60.5 mm × 1.75 mm × 4.0 mm × 4.0 mm × 2.0 mm × 0.25 mm × 8.0 mm × 180 mm × 60 mm.