This Design Support Document details the functions and usage methods of VCSP50L1 (BD6883GUL), including application circuits, circuit constants, etc.
This document describes the VCSP50L1 semiconductor package, including its internal structure, materials, and external dimensions. It also details tape‑and‑reel packaging, labeling, and shipping specifications.
Additional sections cover recommended storage conditions, soldering temperature profiles, peelback strength of the cover tape, and guidance on underfill material usage for reliable mounting.
| Die material | Silicon |
|---|---|
| Lead material | Sn‑3Ag‑0.5Cu |
| Encapsulation material | Epoxy Resin |
| Encapsulation material (alternative) | Polyamide‑imide Resin |
| Recommended storage temperature | 5~30 °C |
| Recommended storage humidity | 40~70 % RH |
| Recommended storage period | 1 year |
| Reflow peak temperature | 260 °C max |
| Preheating temperature range | 130~190 °C |
| Soldering temperature range | 220~230 °C |
| Cover tape peelback strength | 0.2~0.7 N |
| Cover tape peelback speed | 165~180 mm/min |
Store the device at 5 °C to 30 °C with 40 % to 70 % relative humidity for up to one year.
Use a reflow peak temperature up to 260 °C, preheat at 130 °C‑190 °C, and a soldering zone of 220 °C‑230 °C.
The leads are made of Sn‑3Ag‑0.5Cu solder alloy.
The cover tape has a peelback strength of 0.2 N to 0.7 N.