This document provides design support for the VCSP50L1 (BD5468GUL) product manufactured by ROHM. The document includes features and characteristics of the product.
The ROHM VCSP50L1 design support document provides detailed information on the package structure, materials, and handling requirements. It includes tape‑and‑reel packaging data, storage conditions, marking codes, and recommended soldering profiles.
Key sections cover footprint and external dimensions, precautions for handling the silicon substrate, and guidance on underfill materials. The document also lists the recommended reflow temperature profile and storage environment for reliable assembly.
| Package type | VCSP50L1 |
|---|---|
| External dimensions | 1.70 mm × 0.05 mm |
| Storage temperature | 5 °C to 30 °C |
| Storage humidity | 40 % to 70 % RH |
| Storage period | 1 year |
| Maximum reflow temperature | 260 °C |
| Preheating temperature range | 130 °C to 190 °C |
| Soldering temperature range | 220 °C to 230 °C |
| Cover tape peelback strength | 0.2 N to 0.7 N |
Each reel contains 3,000 pieces of the VCSP50L1 package.