This document is the design support document for VCSP50L1 (BD5466GUL)
This design support document provides technical information for the ROHM VCSP50L1 (BD5466GUL) semiconductor package. It covers package structure, material composition, tape‑and‑reel packaging, storage conditions, marking, soldering profiles, footprint and external dimensions, and handling precautions.
Key sections include structure and materials, tape and reel specifications, recommended storage environment, soldering temperature profiles, detailed footprint dimensions, and safety precautions for handling the silicon substrate.
| Package | VCSP50L1 |
|---|---|
| Dehydrated weight | 2.8 mg |
| Quantity per reel | 3,000 pcs |
| Recommended storage temperature | 5 to 30°C |
| Recommended storage humidity | 40 to 70% RH |
| Soldering temperature | 220°C to 230°C |
| Preheating temperature | 130°C to 190°C |
The recommended storage temperature is 5 to 30 °C.
Each reel holds 3,000 pieces of the VCSP50L1 package.
The soldering temperature should be set between 220 °C and 230 °C.
Store the package at 40 % to 70 % relative humidity.