This design support document describes the VCSP50L1 semiconductor package, covering its structure, materials, and marking information. It includes detailed tape‑and‑reel specifications, storage conditions, recommended soldering profiles, and dimensional data for footprint and external size.
Key sections cover handling precautions, underfill recommendations, and packaging details such as reel and box configurations. The document also lists the marking lot number format and provides safety notes for end‑users integrating the component into electronic equipment.
| Package type | VCSP50L1 |
|---|---|
| Dehydrated weight | 0.003 g |
| Recommended storage temperature | 5 °C to 30 °C |
| Recommended storage humidity | 40 % to 70 % RH |
| Specified storage period | 1 year |
| Reflow peak temperature | 260 °C MAX |
| Preheating temperature range | 130 °C to 190 °C |
| Soldering temperature range | 220 °C to 230 °C |
| Cover tape peelback strength | 0.2 N to 0.7 N |
| Footprint pad width | 0.25 mm |
Store the package at temperatures between 5 °C and 30 °C with a relative humidity of 40 % to 70 % RH, and keep it for a maximum period of one year.
Handle the package without touching its side, as the silicon substrate surface is exposed and can be easily cracked.