This document introduces the design support information of VCSP35L2(BR25S128GUZ-W), mainly including product specifications, usage methods and interface definitions.
This design support document describes the VCSP35L2 semiconductor package, covering its structure, materials, and mechanical dimensions. It includes detailed tape‑and‑reel packaging data, marking information, and recommended handling precautions.
The document also specifies storage environment (5‑30 °C, 40‑70 % RH, 1‑year shelf life) and reflow soldering profiles (preheat 130‑190 °C, peak up to 260 °C, soldering zone 220‑230 °C). Additional notes cover peelback strength, missing IC allowances, and safety warnings for use in various equipment.
| Package material – die | Silicon |
|---|---|
| Package material – external terminal | Sn‑3Ag‑0.5Cu solder |
| Mold compound | Polyamide‑imide resin |
| Tape dimensions (mm) | 2.20 × 2.83 × 0.50 × 0.10 … |
| Reel dimensions (mm) | see table in document |
| Quantity per reel | 3,000 pcs |
| Recommended storage temperature | 5 °C to 30 °C |
| Recommended storage humidity | 40 % to 70 % RH |
| Storage period | 1 year |
| Preheat temperature (reflow) | 130 °C to 190 °C |
| Peak reflow temperature | 260 °C max |
| Soldering zone temperature | 220 °C to 230 °C |
| Cover‑tape peelback strength | 0.2 N to 0.7 N |
| Cover‑tape peelback speed | 165 ° to 180° / 300+10 mm/min |
Store the package at 5 °C to 30 °C with 40 % to 70 % relative humidity for up to one year.
Use a preheat of 130 °C to 190 °C, a peak temperature up to 260 °C, and a soldering zone of 220 °C to 230 °C.
Each reel holds 3,000 pieces of the VCSP35L2 package.
The cover‑tape peelback strength is specified as 0.2 N to 0.7 N.