ROHM VCSP50L1 Design Support Document

This document describes the features and characteristics of ROHM's VCSP50L1 (BD5461GUL) product.


ROHM VCSP50L1 Design Support Document - cover page
Brand
ROHM
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
5
File format
PDF
File size
1.3 MB
Published
04 June, 2012
Updated
28 September, 2023
MD5 checksum
0E5C26A5593E17872ACC7A9978BADBDA

About this manual

The ROHM VCSP50L1 design support document provides detailed information on the package structure, materials, and handling precautions. It includes tape‑and‑reel packaging specifications, storage conditions, marking details, and recommended soldering profiles.

Technical data such as footprint and external dimensions, dehydrated weight, and recommended reflow temperature ranges are listed to aid PCB designers and assembly engineers in integrating the VCSP50L1 package into their products.

What's inside

  • Structure and Materials
  • Tape and Reel Information
  • Storage Conditions
  • Marking Lot Number
  • Soldering Conditions
  • Footprint Dimensions
  • External Dimensions
  • Precautions

Specifications

Package typeVCSP50L1
Dehydrated weight0.003 g
Storage temperature5 °C to 30 °C
Storage humidity40 % to 70 % RH
Recommended reflow peak temperature260 °C max
Preheating temperature range130 °C to 190 °C
Soldering temperature range220 °C to 230 °C
Units per reel3,000 pieces

Frequently asked questions

What are the recommended storage conditions for the VCSP50L1 package?

Store the package at 5 °C to 30 °C with 40 % to 70 % relative humidity for up to one year.

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