This document introduces the design support document for ROHM's VCSP50L1 (BD6040GUL) product, including its features and characteristics.
This design support document describes the VCSP50L1 semiconductor package, including its structure, materials, and detailed mechanical dimensions. It also lists tape‑and‑reel packaging details, marking information, and handling precautions.
The document specifies recommended storage conditions, soldering temperature profiles, peelback test methods, and packaging/shipping guidelines to ensure reliable integration of the component into electronic equipment.
| Tape and Reel quantity | 3,000 pcs per reel |
|---|---|
| Storage temperature | 5–30 °C |
| Storage humidity | 40–70 % RH |
| Storage period | 1 year |
| Preheating temperature | 130–190 °C |
| Soldering temperature | 220–230 °C |
| Peelback strength | 0.2–0.7 N |
| Peelback speed | 165–180 mm/min |
Store the component at 5–30 °C with 40–70 % relative humidity for up to 1 year.
Preheat to 130–190 °C, then solder at 220–230 °C, not exceeding a maximum of 260 °C.
Each reel contains 3,000 pieces of the VCSP50L1 package.
The peelback strength of the cover tape is specified as 0.2–0.7 N.