This document introduces ROHM's VCSP50L1 (BD5467GUL) product, including design support documents and product information. The document provides the features and characteristics of the product and mentions ROHM's customer support system.
This design support document provides detailed information for the ROHM VCSP50L1 (BD5467GUL) semiconductor package. It includes the package structure, material composition, tape‑and‑reel packaging specifications, storage conditions, marking, soldering guidelines, footprint and external dimensions, and handling precautions.
The document also contains practical data such as recommended storage temperature and humidity, storage life, peelback strength of the cover tape, and the maximum number of units per reel. It is intended for engineers designing PCBs and for manufacturers handling the component during assembly and logistics.
| Cover tape peelback strength | 0.2 to 0.7 N |
|---|---|
| Recommended storage temperature | 5 °C to 30 °C |
| Recommended storage humidity | 40 % to 70 % RH |
| Specified storage period | 1 year |
| Preheating temperature (reflow) | 130 °C to 190 °C |
| Soldering temperature (reflow) | 220 °C to 230 °C |
| Units per reel | 3,000 pcs |
The package should be stored at 5 °C to 30 °C with 40 % to 70 % relative humidity.
Preheat to 130 °C–190 °C, then solder at 220 °C–230 °C, with a maximum preheat temperature of 260 °C.
Each reel contains 3,000 pieces of the component.