This document introduces the features and characteristics of the ROHM BD2200GUL series products and application circuits.
This design support document describes the VCSP50L1 semiconductor package, covering its structure, materials, and recommended handling. It includes detailed information on tape‑and‑reel packaging, storage conditions, marking, soldering profiles, footprint dimensions, and safety precautions.
Key sections cover the package construction (silicon die, copper posts, epoxy resin molding), tape/reel specifications (3,000 pcs/reel, E2 feed direction), recommended storage (5‑30 °C, 40‑70 % RH, 1‑year period), reflow soldering parameters (up to 260 °C peak, 130‑190 °C preheat, 220‑230 °C soldering), and handling cautions such as avoiding side contact and evaluating underfill materials.
| Package type | VCSP50L1 |
|---|---|
| Die material | Silicon |
| Lead material | Cu |
| Mold compound | Epoxy Resin |
| External terminal solder | Sn‑3Ag‑0.5Cu |
| Tape quantity per reel | 3,000 pcs |
| Tape feed direction | E2 |
| Storage temperature range | 5 °C to 30 °C |
| Storage humidity range | 40 % to 70 % RH |
| Maximum storage period | 1 year |
| Reflow peak temperature (max) | 260 °C |
| Preheating temperature range | 130 °C to 190 °C |
| Soldering temperature range | 220 °C to 230 °C |
| Cover tape peelback strength | 0.2 N to 0.7 N |
Each reel contains 3,000 pieces of the VCSP50L1 package.