This design support document introduces the features, parameters, application circuits, etc. of VCSP50L1 chip, for reference of designers.
This document provides detailed information on the VCSP50L1 package, including its structure, materials, and marking. It also describes tape‑and‑reel packaging, storage conditions, and recommended soldering profiles.
Additional sections cover footprint and external dimensions, handling precautions, and guidelines for underfill materials. The document is intended for designers and manufacturers integrating the component into electronic equipment.
| Storage temperature range | 5 °C to 30 °C |
|---|---|
| Storage humidity range | 40 % to 70 % RH |
| Specified storage period | 1 year |
| Maximum reflow soldering cycles | 3 times |
| Reflow soldering temperature range | 220 °C to 230 °C |
| Preheating temperature (max) | 260 °C |
| Cover tape peelback strength | 0.2 to 0.7 N |
| Dehydrated weight | 3.1 mg |
| Tape and Reel quantity | 3,000 pcs per reel |
The package should be stored at 5 °C to 30 °C with 40 % to 70 % relative humidity.
A maximum of three reflow soldering cycles is permitted.
The soldering temperature should be between 220 °C and 230 °C.
Each reel contains 3,000 pieces of the VCSP50L1.