The document describes the features and characteristics of the K4S641633H-R(B)E/N/G/C/L/F model mobile SDRAM product, including 3.0V and 3.3V power supply, LVCMOS compatibility, four banks operation, MRS and EMRS cycle, etc.
The K4S641633H is a 1M × 16‑bit mobile SDRAM offered in a 54‑ball FBGA package. It supports 3.0 V and 3.3 V power supplies, LVCMOS‑compatible multiplexed address, and multiple burst lengths and latencies.
The document provides absolute maximum ratings, recommended DC and AC operating conditions, timing parameters, package dimensions, and power‑up and burst sequences for both commercial and extended temperature ranges.
| Power supply voltage | 3.0 V & 3.3 V |
|---|---|
| Package type | 54‑ball FBGA, 0.8 mm ball pitch |
| Maximum operating frequency | 133 MHz (CL = 3) |
| Extended temperature range | -25 °C ~ 85 °C |
| Storage temperature range | -55 °C ~ +150 °C |
It supports 3.0 V and 3.3 V power supplies.
The extended version operates up to 85 °C.
It uses a 54‑ball FBGA package with a 0.8 mm ball pitch.