Samsung K5L5628JT(B)M Multi-Chip Package Memory Datasheet

K5L5628JT(B)M is a 256M Bit (16M x16) Synchronous Burst , Multi Bank NOR Flash / 128M Bit(8M x16) Synchronous Burst UtRAM launched by Samsung


Samsung K5L5628JT(B)M Multi-Chip Package Memory Datasheet - cover page
Brand
Samsung
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
98
File format
PDF
File size
1.6 MB
Published
01 April, 2012
Updated
30 September, 2023
MD5 checksum
D031AD0378B6EDDF1F03B9E756DB3292

About this manual

The K5L5628JT(B)M is a Multi‑Chip Package (MCP) memory that combines a 256Mbit synchronous burst multi‑bank NOR Flash with a 128Mbit synchronous burst UtRAM. It is targeted for mobile communication systems where reduced board area and low power consumption are critical.

Key specifications include a -30 °C to 85 °C operating temperature range, 115‑ball FBGA package (8.0 mm × 12.0 mm), dual‑voltage operation (1.7‑1.95 V for NOR, 2.5‑2.7 V for UtRAM), burst access times as low as 14.5 ns, and power consumption of 30 mA (burst) and 15 mA (program/erase). The device supports various burst modes, block protection, and power‑saving features such as Partial Array Refresh.

What's inside

  • Features
  • General Description
  • Pin Configuration
  • Pin Description
  • Ordering Information
  • Functional Block Diagram
  • Product Line‑up
  • Device Bank Divisions
  • Transition Timing Waveform
  • Package Dimension

Specifications

Operating Temperature-30°C ~ 85°C
Package Type115‑ball FBGA, 8.0 mm × 12.0 mm
NOR Flash Voltage1.7 V to 1.95 V (Read/Write)
UtRAM Voltage2.5 V to 2.7 V (Vcc), 1.7 V to 2.0 V (Veca)
Burst Access Time (54 MHz)14.5 ns
Initial Access Time (54 MHz)88.5 ns
Program/Erase Current15 mA
Burst Access Current30 mA
Standby / Auto‑Sleep Current25 µA
Endurance100 k program/erase cycles
Data Retention10 years
Maximum Burst Clock Frequency52.9 MHz

Frequently asked questions

What temperature range does the K5L5628JT(B)M operate in?

It operates from –30 °C to 85 °C.

What is the package type and size of the device?

The device uses a 115‑ball FBGA package measuring 8.0 mm × 12.0 mm.

What are the power consumption figures for burst and program/erase operations?

Burst access current is 30 mA, while program/erase current is 15 mA.

How many program/erase cycles can the memory endure?

It is rated for at least 100 k program/erase cycles.

Download PDF (1.6 MB)

More Samsung Manuals


View all Samsung manuals →