This is a printed circuit board print pattern for SOT598-1
This document supplies the footprint information required for reflow soldering of the Philips SOT598-1 (TFBGA100) package. It includes definitions of solder land, solder paste deposit, occupied area, and solder resist zones.
The sheet lists the exact dimensions in millimetres for pads, solder lands, solder paste, and resist areas, and refers to the package outline drawing for the final layout.
| Package type | TFBGA100 |
|---|
It uses a TFBGA100 package.
Refer to the package outline drawing for the actual layout.