This file is Philips Semiconductors PC board footprint information for reflow soldering of VSO40 package
This document describes the PCB footprint for the Philips SOT158-1 (VSO40) semiconductor package, including reflow soldering recommendations. It is intended for designers creating printed circuit boards that will host this component.
The sheet lists the exact dimensions of the pad layout (P1, P2, Ay, By, etc.) and references the package outline drawing for the final layout. A generic footprint pattern is also shown for quick reference.