This document provides information about the PC board footprint dimensions for reflow soldering of the Philips Semiconductors SOT315-1 package. It includes detailed information on the solder land, occupied area, and dimensions for the LQFP80 package.
The document presents the PCB footprint information for the Philips SOT315-1 component, intended for reflow soldering of the LQFP80 package. It includes the generic footprint pattern and references the package outline drawing for the actual layout.
Key dimensions such as pad size, pitch, and occupied area are listed in millimetres, allowing designers to correctly place and size the solder lands on a printed circuit board.
| Pin pitch (P2) | 0.500 mm |
|---|---|
| Pad width (Ax) | 0.560 mm |
| Pad length (Ay) | 15.300 mm |
| Package type | LQFP80 |
The SOT315-1 footprint is for the LQFP80 package.
It was published on 29 December 2004.