This is the PCB footprint information for Philips Semiconductors SOT505-2_fp, which contains dimensions etc.
This document provides the PCB footprint information required for reflow soldering of the Philips SOT505-2 (TSSOP8) package. It includes the generic footprint pattern and references the package outline drawing for the actual layout.
Key dimensions are listed in millimetres, specifying pad sizes, pitch, and overall footprint extents. The data can be used to create accurate PCB land patterns for manufacturing.