Philips SOT765-1 VSSOP8 Package Footprint Datasheet

About this manual

This document defines the PCB footprint for the Philips SOT765-1 VSSOP8 semiconductor package, including reflow soldering recommendations. It is intended for PCB designers and manufacturers who need accurate layout data.

The footprint dimensions are listed in millimetres, and a generic pattern is shown. Users should also refer to the package outline drawing for the exact layout details.

What's inside

• Footprint Overview
• Generic Footprint Pattern
• Dimensions
• Reference Drawing
• Copyright Information

Frequently asked questions

Where can I find the official layout drawing for the SOT765-1?

Refer to the package outline drawing mentioned in the document for the actual layout.

Who holds the copyright for this footprint document?

© Koninklijke Philips Electronics N.V., 2004.