Philips SOT811-1 PC Board Footprint Datasheet

This is a PDF file that contains the printed circuit board printing drawing of SOT811-1.

Brand: Philips
Category: Other Electronics
Document type: Datasheet
Language: English
Pages: 1
File format: PDF
File size: 11 KB
Published: 22 March, 2012
Updated: 30 September, 2023
MD5 checksum: 4F40D4AB9C394586FE92E4F0D8E1CABB
PDF: Philips SOT811-1 PC Board Footprint Datasheet PDF

About this manual

This document describes the recommended PCB footprint for reflow soldering of the Philips SOT811-1 BGA256 package. It includes details on solder land, solder paste deposit, and occupied area.

The generic footprint pattern and exact dimensions are listed, and users are directed to the package outline drawing for the complete layout.

What's inside

Footprint Information
Solder Land and Paste
Generic Footprint Pattern
Dimensions (mm)
Package Outline Reference

Specifications

Package type	BGA256
Footprint dimensions (mm)	P 1.00, SL 0.450, sP 0.450, SR 0.600, Hx 17.575, Hy 17.575

Frequently asked questions

What are the dimensions of the SOT811-1 footprint?

The footprint dimensions are P 1.00 mm, SL 0.450 mm, sP 0.450 mm, SR 0.600 mm, Hx 17.575 mm, and Hy 17.575 mm.

Where can I find the complete layout for the SOT811-1 package?

Refer to the package outline drawing for the actual layout.

Download PDF (11 KB)